Method for handling and processing microelectronic-device substrate assemblies

ABSTRACT

Methods for selectively moving a microelectronic-device substrate assembly in a processing machine having a first side, a second side opposite the first side, and a processing path extending from the first side to the second side. The processing machine can also include a cassette proximate to a second side of the processing station that moves to position a substrate at the processing path. In one aspect of the invention, the substrate handling apparatus includes a guide member attached to the processing machine, an arm slidably attached to the guide member, and a clamp attached to the arm. The guide member is generally fixedly attached to the processing machine, and the guide member generally has a shape corresponding to the processing path. The arm can include a first section moveably attached to the guide member to translate along the guide member, and a second section projecting from the first section to position at least a portion of the second section at least proximate to the processing path. The clamp is coupled to the second section of the arm in alignment with the processing path. A motor is coupled to the arm via a drive member to move the arm along the guide member between a first position in which the clamp is near the first side of the plate assembly and a second position in which the clamp is near the cassette at the second side of the plate assembly.

TECHNICAL FIELD

The present invention relates to methods for handling and processingmicroelectronic-device substrate assemblies, such as semiconductorwafers, field emission displays and other types of substrates with oneor more microelectronic-devices. More particularly, the presentinvention relates to handling and processing substrate assemblies whenthe substrate assemblies are attached to a backing film stretched over aframe.

BACKGROUND OF THE INVENTION

Microelectronic-device substrate assemblies are typically semiconductorsubstrates used in the manufacturing of semiconductor devices, fieldemission displays and other microelectronic devices. In a typicalapplication for manufacturing semiconductor devices, the substrateassemblies are semiconductor wafers upon which a plurality of individualdevices are formed in several processing steps. Memory devices, forexample, are fabricated on 6-12 inch wafers that provide enough surfacearea to fabricate several hundred individual memory devices on a singlesubstrate assembly. After the circuits of the individual devices havebeen constructed, the substrate assembly is cut to separate the devicesfrom one another, and then the individual devices are often packaged formounting to a printed circuit board assembly.

One aspect of manufacturing or using substrate assemblies is handlingthe substrate assemblies in processing machines. Substrate assembliesare fairly delicate structures that may chip or crack, and theintegrated circuits of the individual devices are very delicatestructures that may be damaged or destroyed by static electricity. Toprotect the substrate assemblies during certain stages of processing,the substrate assemblies are attached to a backing film that isstretched over a metal frame to avoid directly contacting the substrateassemblies with the handling equipment. In a typical fabricationprocess, for example, substrate assemblies are coupled to frames by thebacking film for processing in a dicing machine that cuts the substrateassemblies to separate the devices from one another. Additionally,because the backing film may stretch and cause difficulties in cuttingthe substrate assemblies in the dicing machines, the frames and thesubstrate assemblies are placed in an “expander” machine that shrinksthe backing film until it is taut. Existing expander machines, however,have many drawbacks that make it difficult to handle substrateassemblies.

FIG. 1 is an isometric view partially illustrating an existing expandermachine 10 that has a processing station 20, a loader 30 and a cassette50. The processing station 20 has a plate assembly with a first plate 22and a second plate 24 spaced apart from one another by a gap 26. Anumber of posts 27 attached to the table 12 support the first and secondplates 22 and 24 to position the plate gap 26 at a desired elevationwith respect to the cassette 50. The processing station 20 has a firstside 28 facing the loader 30 and a second side 29 facing the cassette50.

The loader 30 is mounted to a base 31 proximate to the first side 28 ofthe processing station 20. The loader 30 has a housing 32, a motor 33attached to the housing 32, and a spring-loaded tape assembly 34 with athin metal tape 36 that projects from the housing 32. The tape 36includes a plurality of holes 38 arranged in a line along the length ofthe tape 36 to receive the teeth of a sprocket 39 attached to an outputshaft of the motor 33. A clamp 40 is attached to the end of the tape 36.The clamp 40 has a pair of clips 42, and each clip 42 has an upperfinger and a lower finger that are biased toward one another.

In operation, the motor 33 turns the sprocket 39 to move the tape 36 andthe clamp 40 along a processing path P through the gap 26 between thefirst and second plates 22 and 24. For example, to remove a selectedsubstrate assembly from the cassette 50, the motor 33 drives the tape 36out of the tape assembly 34 until the clamp 40 engages a frame 52 towhich the selected substrate assembly is attached via a backing film.The motor 33 then reverses the rotation of the sprocket 39 to pull theframe 52 and selected substrate assembly out of the wafer cassette 50and into the plate gap 26 between the first and second plates 22 and 24at the processing station 20. The spring-loaded tape assembly 34accordingly recoils a portion of the tape 36 in a manner similar to atape measure. After the substrate assembly has been processed at theprocessing station 20, the motor 33 rotates the sprocket 39 to drive thetape 36 from the tape assembly 34 until the frame 52 and selectedsubstrate assembly are replaced in the wafer cassette 50. The motor 33then reverses the rotation of the sprocket 39 very quickly to disengagethe clips 42 from the frame 52 and retract the clamp 40 to the loader30.

One drawback with the expander machine 10 is that the loader 30 may notaccurately drive the tape 36 and the clamp 40 along the processing pathP to accurately pick up, position and release the frames 52 forprocessing the substrate assemblies. More particularly, the thin metaltape 36 often cracks in a line between the holes 38. The teeth of thesprocket 39 may accordingly pass through the cracks between the holes 38in the thin metal tape instead of pushing against the portion of thetape 36 between the holes 38. The cracks in the tape 36 between theholes 38 typically develop to a point at which the loader 30 isinoperable and the tape assembly 34 must be replaced. Repairing theloader 30, however, results in down-time for the expander machine 10.Thus, the durability of the tape assembly 34 is a significant drawbackin handling microelectronic-device substrate assemblies in the expandermachine 10.

Another problem of the expander machine 10 is that the clamp 40 may hitone of the first and second plates 22 and 24 of the processing station20 as the loader 30 drives the tape 36 from the loader 30 to thecassette 50. This problem arises because the clamp 40 causes the thintape 36 to bend downward as the clamp 40 moves from the loader 30 towardthe processing station 20. The vertical displacement of the clamp 40accordingly increases with increasing distance from the loader 30 suchthat the height of the loader 30 is generally adjusted at the initialset-up so that the clamp 40 passes through the plate gap 26 on both thefirst and second sides 28 and 29 of the processing station 20. Moreover,as the thin tape 36 wears and cracks develop between the holes 38, thebend radius of the tape 36 changes over time causing the verticaldisplacement of the clamp 40 along the processing path to also change.The clamp 40 may even hit one of the first or second plates 22 or 24when the tape 36 wears down after a period of use. When this occurs, theheight of the loader 30 must be readjusted to compensate for the changesin the integrity of the tape 36. Adjusting the height of the loader 30so that the clamp 40 passes through the gap 26 of the processing station20 is a difficult and time-consuming process because it is generally atrial-and-error procedure. Therefore, constantly adjusting andreadjusting the loader 30 so that the clamp 40 can “shoot the gap” ofthe plate gap 26 also causes down-time for the expander machine 10.

Still another drawback of the expander machine 10 is that the clamp 40may not positively engage or disengage the frames 52. The frames 52 weardown the interior surfaces of the clips 42 causing a gap to form betweenthe fingers of each clip 42. After the frames 52 wear down the interiorsurfaces of the clips 42, the clamp 40 may not sufficiently engage aframe 52 to pull the frame 52 out of the cassette 50. Therefore, thedurability of the clamp 40 also presents another operating concern ofusing the expander machine 10.

SUMMARY OF THE INVENTION

The present invention is directed towards methods for selectively movinga microelectronic-device substrate assembly in a processing machine, andmethods of operating such processing machines. A typical processingmachine includes a processing station having a first side, a second sideopposite the first side, and a processing path extending from the firstside to the second side. The processing machine can also include amoveable cassette proximate to a second side of the processing stationthat moves to position a selected substrate assembly at the processingpath.

In one aspect of the invention, a substrate handling apparatus includesa guide member attached to the processing machine, an arm slidablyattached to the guide member, and a clamp attached to the arm. The guidemember is generally fixedly attached to the processing machine, or it isotherwise fixed with respect to the processing path. The guide memberalso generally has a shape extending along the processing machine atleast substantially parallel to the processing path. The guide member,for example, can be an elevated beam above the table, a rail on thetable, a channel in the table, a threaded ball-screw, or otherstructures that can guide the arm along the processing path.

The arm of the guide assembly can include a first section moveablyattached to the guide member to translate along the guide member, and asecond section projecting from the first section. The first and secondarm sections are configured to position at least a portion of the secondsection at least proximate to the processing path. For example, thefirst arm section can be a bracket attached to the guide member and thesecond arm section can be a bar projecting from the bracket transverseto the processing path to position a portion of the bar over theprocessing path. The clamp is coupled to the second section of the armat the clamp location in alignment with the processing path. The clampgenerally has a pair of jaws to releasably grip a selected framesupporting a selected substrate assembly.

The substrate handling apparatus also includes a drive mechanism havinga motor and a drive member. The drive member is coupled to both themotor and the arm to transfer an output from the motor to the arm. Themotor can be a servo motor, and the drive member can be one or morebelts coupled to sprockets or pulleys to transfer the rotational outputof the motor to a linear action along the guide member.

In a particular aspect of the invention, the motor and the drive memberselectively move the arm along the guide member between a first positionin which the clamp is near the first side of the plate assembly and asecond position in which the clamp is near the cassette at the secondside of the plate assembly. The drive mechanism accordingly moves theclamp at an elevation along the processing path through the processingstation such that the clamp holds a selected substrate assembly at theprocessing station in the first position, or the clamp grips or releasesthe selected frame and substrate assembly at the cassette in the secondposition. For example, the clamp can have an actuator coupled to a jawassembly with first and second jaws. When the clamp is in the secondposition, the actuator closes the jaws to grip the selected frame. Thedrive mechanism then moves the arm along the guide member to carry thesubstrate assembly from the second position to the first position at theprocessing station. After the substrate assembly has been processed, thedrive mechanism moves the arm back along the guide member until theclamp is in the second position. The actuator then opens the clamp jawsto release the selected frame and place the selected frame and substrateassembly back in the cassette.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric view of an existing expander machine with aloader in accordance with the prior art.

FIG. 2 is an isometric view of an expander machine with a handlingassembly used in a method in accordance with one embodiment of theinvention.

FIG. 3 is a front elevational view partially illustrating the expandermachine and the handling assembly of FIG. 2.

FIG. 4 is an isometric view of an embodiment of a clamp assembly for usewith a handling system used in a method in accordance with theinvention.

FIG. 5 is an isometric view of an embodiment of another clamp assemblyfor use with a handling system used in a method in accordance with theinvention.

FIG. 6 is an isometric view of another embodiment of a handling assemblyused in a method in accordance with another embodiment of the invention.

FIG. 7 is an isometric view of yet another embodiment of a handlingsystem used in a method in accordance with yet another embodiment of theinvention.

FIG. 8 is an isometric view of still another embodiment of a handlingsystem used in a method in accordance with still another embodiment ofthe invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is directed toward methods for manufacturing andhandling of microelectronic-device substrate assemblies. Many specificdetails of certain embodiments of the invention are set forth in thefollowing description, and in FIGS. 2-8, to provide a thoroughunderstanding of these particular embodiments. One skilled in the art,however, will understand that the invention may have additionalembodiments, or that the invention may be practiced without several ofthe details described in the following description.

FIG. 2 is an isometric view of an expander machine 110 with two waferhandling apparatuses 130 in accordance with one embodiment of theinvention. The expander machine 110 has a cassette 114 attached to atable 112, first and a second processing stations 120 a and 120 b(collectively referred to in the text by reference number 120)positioned at one side of the cassette 114, and one substrate handlingapparatus 130 for each of the processing stations 120. The processingstations 120 are generally similar to one another, and the substratehandling apparatus 130 at the processing stations are also similar toone another. Thus, for the purpose of brevity, the first processingstation 120 a and the substrate handling apparatus 130 at the firstprocessing station 120 a are described herein with the understandingthat like reference numbers refer to like parts in the second processingstation 120 b.

The cassette 114 holds a plurality of frames 115 andmicroelectronic-device substrate assemblies 117 (only one assemblyshown). In a typical application, a thin backing film 116 is attached toeach frame 115, and a microelectronic-device substrate assembly 117 isattached to the backing film 116. The substrate assemblies 117 aregenerally coupled to the frames 115 via the backing film 116 to providea rigid frame to handle the substrate assemblies 117 without directlycontacting the substrate assemblies 117 with the handling equipment.

The first processing station 120 a has first and second plates 122 and124 spaced apart from one another by a plate gap 126. Additionally, thefirst plate 122 generally has a first slot 125 at a first side 128 ofthe processing station 120 a, and a second slot 127 at a second side 129of the processing station 120 a. The first and second slots 125 and 127are aligned with a processing path P₁ extending through the firstprocessing station 120 a to the cassette 114. The second plate 124 isgenerally mounted to the table 112 by a number of posts (not shown), andthe first plate 122 is spaced apart from the second plate 124 by anumber of spacers (not shown). The gap 126 between the first and secondplates 122 and 124 is accordingly positioned at a selected elevationwith respect to the cassette 114.

The second processing station 120 b has only a first plate 122 attachedto the frame 112 by a number of posts (not shown). A single slot 125extends along the first plate 122 of the second processing station 120 bfrom a first side 128 to a second side 129. The slot 125 defines aprocessing path P₂ of the second processing station 120b. In light ofthe structure of the processing stations 120 and the cassette 114, anembodiment of a substrate handling apparatus 130 will now be described.

FIG. 3 is a front elevational view of the substrate handling apparatus130 at the first processing station 120 a of the expander machine 110.Referring to FIGS. 2 and 3 together, the substrate handling apparatus130 has a guide assembly 140 (FIG. 2) to hold a clamp 150 at a fixedelevation with respect to the first and second plates 122 and 124 alongthe processing path P₁, and a drive mechanism 160 to operate the guideassembly 140. As described below, the guide assembly 140 and the drivemechanism 160 shown in FIGS. 2 and 3 provide a durable device thatconsistently moves the clamp 150 along the processing path P₁.

The embodiment of the guide assembly 140 shown in FIGS. 2 and 3 has afixed guide member 142 attached to the table 112 and an arm 144 movablyattached to the fixed guide member 142. The fixed guide member 142extends in a direction corresponding to the processing path P₁. Thefixed guide member 142, more particularly, generally extends at leastsubstantially parallel to the processing path P₁ at the side of theprocessing path P₁. In an alternative embodiment (not shown), the fixedguide member 142 can be superimposed above or below the processing pathP₁. In the embodiment illustrated in FIGS. 2 and 3, the fixed guidemember 142 is an elevated beam attached to legs 143 a and 143 b that aremounted to the processing machine 110 proximate to the edge of the table112.

The arm 144 of the guide assembly 140 translates along the guide member142 to move at least a portion of the arm along the processing path P₁.In the embodiment shown in FIGS. 2 and 3, the arm 144 includes a firstarm section 146 slidably attached to the guide member 142 and a secondarm section 148 attached to the first section 146. The first arm section146, for example, can be a bracket that slides along the guide member142, or the first arm section 146 may have a plurality of rollers thatroll along the guide member 142. The second section can have a first endattached to the first section 146 and a second end projecting from thefirst section 146 to a location either on or superimposed with theprocessing path P₁. The second arm section 148, for example, can be abar projecting from the first arm section 146 transverse to theprocessing path P₁ to position a portion of the second arm section 148over the processing path P₁. The arm 144 can also have an adjustableclamp holder 149 attached to the second end of the second arm section148 to move vertically with respect to the second arm section 148 forpositioning the clamp 150 at the processing path P₁.

The arm 144 is generally made from a lightweight and rigid material,such as aluminum or suitable plastics. Additionally, the second armsection 148 has a sufficient thickness and shape to extend over theprocessing station 120 a without bending to support the clamp 150 at aconstant elevation with respect to the processing station 120 a. Asshown in FIGS. 2 and 3, the arm 144 can be positioned above the firstplate 122 of the processing station 120 a, and the clamp holder 149 canproject downwardly from the arm 144 through the slots 125 and 127 in thefirst plate 122 to position the clamp 150 in the plate gap 126. Inanother embodiment (not shown), the second arm section 148 can beconfigured to move through the plate gap 126 between the first andsecond plates 122 and 124, and the clamp 150 can be attached directly tothe second end of the second arm section 148 without the clamp holder149. In the embodiment in which the second arm section 148 passesthrough the plate gap 126, the first plate 122 does not necessarily haveslots 125 and 127 because the clamp holder 149 is not attached to thesecond arm section 148.

The drive mechanism 160 has a motor 161 attached to the table 112 and adrive member 170 (indicated by reference numbers 170 a and 170 b inFIGS. 2 and 3). The drive member 170 is coupled to the motor 161 and tothe first arm section 146 such that the motor 161 and the drive member170 selectably move the first aim section 146 along the guide member 142to position the clamp 150 at desired locations along the processing pathP₁. The motor 161 is generally a servo motor with a drive shaft 162 anda drive sprocket 164 attached to the drive shaft 162. The drive sprocket164 may alternatively be a gear, pulley or other type of device tooperatively engage the particular type of drive member 170.

The embodiment of the drive member 170 shown in FIGS. 2 and 3 has afirst belt 170 a and a second belt 170 b (best shown in FIG. 2).Referring to FIG. 3, the first belt 170 a is engaged with the drivesprocket 164 and a first passive sprocket 172 a mounted to a firstpassive shaft 174 a attached the right leg 143 a. The second belt 170 bis coupled to a second passive sprocket 172 b mounted to the firstpassive shaft 174 a, and the second belt 170 b is coupled to a thirdpassive sprocket 172 c mounted to a second passive shaft 174 b attachedto the left leg 143 b. The second belt 170 b accordingly extends alongthe fixed guide member 142, and an upper portion of the second belt 170b is fixedly attached to the first arm section 146. The first and secondbelts 170 a and 170 b may be similar to timing belts with transversegrooves 175 arranged along the back side of the belts to engage thesprockets 164 and 172 a-172 c. In alternative embodiments, the first andsecond belts 170 a and 170 b can also be regular belts without thetransverse grooves, or they can be chains.

The drive mechanism 160 moves the aim 144 along the guide member 142between a first position in which the clamp 150 is near the first side128 of the processing station 120 a, and a second position in which theclamp 150 is near the cassette 114 at the second side 129 of theprocessing station 120 a. To move the clamp 150 along the processingpath P₁ toward the cassette 114 with the drive mechanism 160 shown inFIGS. 2 and 3, the motor 161 rotates the drive sprocket 164counter-clockwise (from the perspective of FIG. 2) to rotate the firstpassive shaft 174 a counter-clockwise via the first belt 170 a and thefirst passive sprocket 172 a. The counter-clockwise rotation of thefirst passive shaft 174 a rotates the second passive sprocket 172 bcounter-clockwise to move the upper portion of the second belt 170 btoward the cassette 114. The second belt 170 b accordingly pulls thefirst arm section 146 along the guide member 142 toward the cassette 114to position the clamp 150 in the second position proximate to thecassette 114. The clamp 150 then engages a selected wafer frame 115 inthe cassette 114. After the clamp 150 securely grips the selected waferframe 115, the servo motor 161 rotates the drive sprocket 164 in theclockwise direction to move the first arm section 146 along the guidemember 142 away from the cassette 144 until the clamp 150 is in thefirst position proximate to the first side 128 of the processing station120 a.

After the handling apparatus positions the substrate assembly 117 at thefirst processing station 120 a, the expander machine 110 shrinks thethin backing film 116. The backing film 116 accordingly contracts totighten the backing film 116 on the frame 115. The motor 161 thenrotates the drive sprocket 164 counter-clockwise to move the clamp 150into first position for replacing the substrate assembly into thecassette 114. The cassette is incrementally raised or lowered toposition another substrate assembly 117 and frame 115 at the elevationof the clamp, and the process is repeated to tighten the backing filmholding another substrate assembly 117.

FIG. 4 is an isometric view illustrating one embodiment of the clamp 150in greater detail. In this embodiment, the clamp 150 has a fixed upperjaw 152, a movable lower jaw 154, and an actuator 156 operativelycoupled to the lower jaw 154. The actuator 156 is generally a pneumaticcylinder, but the actuator 156 can be a hydraulic cylinder, an electricmotor or another type of actuator. The actuator 156 moves the lower jaw154 with respect to the upper jaw 152 to positively clamp or disengage aselected frame 115. For example, when the clamp 150 is in the secondposition to remove a substrate 117 from the cassette 114 (FIG. 2), theactuator 156 moves the lower jaw 154 upward to clamp the frame 115between the jaws 152 and 154. Conversely, to replace a substrateassembly 117 in the cassette 114, the actuator 156 moves the lower jaw154 downward to disengage the frame 115. The clamp 150 accordinglyprovides positive engagement and disengagement of the frame 115 withoutrelying on clips that wear out and may not provide sufficient frictionagainst the frame 115.

FIG. 5 is an isometric view illustrating another clamp 250 with movableupper and lower jaws 252 and 254. In this embodiment, an actuator 256 iscoupled to both the upper and lower jaws 252 and 254. The actuator 256moves the jaws 252 and 254 toward or away from one another for engagingor disengaging a frame 115, respectively, to operate in a similar manneras the clamp 150. The actuator 256 may also be a pneumatic cylinder, ahydraulic actuator, an electric motor or any type of suitable actuationdevice.

The substrate handling apparatus 130 illustrated in FIGS. 2 and 3provides a durable system to avoid down-time for the expander machine110. One aspect of the substrate handling apparatus 130 that makes itdurable is that the guide assembly 140 is generally made from rigid,sturdy components that can withstand the forces and the friction thatoccur when handling substrate assemblies over a period of time.Additionally, the drive member 170 is also a sturdy component, such as atiming belt or chain, that can also withstand the forces of moving asubstrate assembly between the cassette 114 and the processing station120. Thus, compared to existing loaders that support a clamp with athin-tape, the substrate handling apparatus 130 is expected to reducethe down-time for repairing and maintaining expander machines and otherprocessing machines.

The wafer expander machine 110 is also expected to alleviate theproblems of “shooting the gap” experienced by the conventional expandermachine 10 described in FIG. 1. The guide assembly 140, for example, hasrigid components that do not bend and cause vertical displacement of theclamp 150 along the length of the processing path P₁. Moreover, the arm144 translates along the guide member 142 to move at a constantelevation in a direction at least substantially parallel to theprocessing path P₁. The substrate handling apparatus 130 accordinglyconsistently moves the arm 144 and the clamp 150 along the processingpath. The slots 125 and 127 in the first plate 122 of the firstprocessing station 120 a also receive the clamp holder 149 and the clamp150 at the level of the processing path P₁. The first plate 122accordingly accommodates the clamp 150 so that the clamp holder 149 andthe clamp 150 can move through the plate gap 126 without the possibilityof hitting the first plate 122. Thus, the controlled motion of thesubstrate handling apparatus 130 and the slots 125 and 127 in the firstplate 122 of the processing station 120 a operate together to alleviatethe problem of “shooting the gap” experienced with the conventionalexpanding machines 10 shown in FIG. 1.

The clamps 150 and 250 illustrated in FIGS. 4 and 5 also providepositive engagement and disengagement of the frames 115 to accuratelyload and unload the frames 115 from the cassette 114. Existing clamps inexisting loaders have spring-type clips that may not provide sufficientfriction to grip the frames because the clips may wear over time. Theclamps 150 and 250 illustrated in FIGS. 4 and 5 overcome this problem byusing an actuator to selectively move the jaws between an engagedposition and a disengaged position. Therefore, the expander machine 110is expected to provide better engagement and disengagement of the waferframes 115 compared to existing expander machines.

FIG. 6 is an isometric view illustrating an expander machine 210 inaccordance with another embodiment of the invention. The expandermachine 210 has a cassette 114 and a processing station 120 a similar tothose described above with respect to the expander machine 110. Theexpander machine 210, however, has a different guide assembly with aguide member 242 that is a rail attached directly to the table 112.Additionally, the guide assembly has an arm 244 with a first section 246slidably attached to the guide member 242 and a second arm section 248projecting upward from the first section 246 and transverse to theprocessing path P₁ to locate the clamp 150 along the processing path P₁.The second arm section 248, for example, can be an L-shaped bar toposition the clamp 150 at the processing path P₁. The expander machine210 also has a motor 161 mounted vertically to the table 112 such thatthe drive member 170 wraps around the drive sprocket 164 and a passivesprocket 172. The drive member 170 can be a belt or chain, as describedabove. The drive member 170 is also fixedly attached to the firstsection 246 of the arm 244. Accordingly, the motor 161 rotates the drivesprocket 164 to move the drive member 170 and slide the aim 244 alongthe guide member 242.

FIG. 7 is an isometric view illustrating an expander machine 310 inaccordance with another embodiment of the invention. In this embodiment,the expander machine 310 has a guide assembly with a guide member 342that is an elongated slot or channel in the table 112. The guideassembly also has an arm 344 with a first arm section 346 having a key347 positioned in the guide member 342, and an L-shaped second armsection 348 attached to the first arm section 346. The motor 161 and theguide member 170 are the same as those described above with reference tothe expander machine 210 shown in FIG. 6.

FIG. 8 is an isometric view illustrating an expander machine 410 inaccordance with yet another embodiment of the invention. In thisembodiment, the drive mechanism has a motor 161 with a drive shaft 162,and a threaded drive member 470 coupled to the drive shaft 162. Thedrive member 470 is preferably a ball screw with a freely rotating ball471 received in a block 472 attached to the table 112. The expandermachine 410 also has an arm 444 with a first arm section 446 threadedlycoupled to the drive member 470 and an L-shaped second arm member 448projecting from the first arm member 446. The motor 161 rotates thedrive member 470 to translate the first arm section 446 along the drivemember 470. The drive member 470 accordingly also acts as a guide memberfor the aim 444. The expander machine 410, therefore, combines the guidemember and the drive member into a single component that both guides anddrives the aim 444 along the processing path P₁.

From the foregoing it will be appreciated that, although specificembodiments of the invention have been described herein for purposes ofillustration, various modifications may be made without deviating fromthe spirit and scope of the invention. For example, the substratehandling apparatuses are described above with reference to expandermachines, but the substrate handling apparatuses can also be used inother processing machines used in the fabrication or packaging ofmicroelectronic devices. Accordingly, the invention is not limitedexcept as by the appended claims.

What is claimed is:
 1. A method for handling a wafer assembly having aframe, a backing film attached to the frame, and amicroelectronic-substrate assembly attached to the backing film, themethod comprising; moving a clamp of a substrate handling apparatus atan elevation along a processing path through a processing station of aprocessing machine by sliding an arm attached to the clamp along a guidemember having an elongated shape corresponding to the processing path,the clamp being selectively moved between a first position at a firstside of the processing station to hold a substrate assembly at theprocessing station and a second position at a second side of theprocessing station to grip or release a selected frame and substrateassembly in a cassette, wherein the guide member comprises an elongatedbeam fixedly attached to first and second legs projecting from a tableof the processing machine, the beam having a length defining alongitudinal axis and the beam being spaced apart from the processingpath, the arm comprises a first arm section having a bracket slidablyattached to the beam to slide along the longitudinal axis and a secondarm section having a bar attached to the bracket and extendingtransversely from the bracket, and wherein moving the clamp comprisessliding the bracket along the beam; and operating the clamp in thesecond position by either gripping the selected frame to carry thesubstrate assembly from the second position to the first position at theprocessing station, or releasing the selected frame to place theselected frame and substrate assembly back in the cassette.
 2. A methodfor handling a wafer assembly having a frame, a backing film attached tothe frame, and a microelectronic-substrate assembly attached to thebacking film, the method comprising; moving a clamp of a substratehandling apparatus at an elevation along a processing path through aprocessing station of a processing machine by sliding an arm attached tothe clamp along a guide member having an elongated shape correspondingto the processing path, the clamp being selectively moved between afirst position at a first side of the processing station to hold asubstrate assembly at the processing station and a second position at asecond side of the processing station to grip or release a selectedframe and substrate assembly in a cassette, wherein the guide membercomprises an elongated rail fixedly attached to a table of theprocessing machine, the rail having a length defining a longitudinalaxis and the rail being spaced apart from the processing path, and thearm comprises a first arm section having a block with a slot receivingthe rail to slidably attach the block to the rail and a second armsection having a bar attached to the block and extending transverselyfrom the block, and wherein moving the clamp comprises sliding the blockalong the rail; and operating the clamp in the second position by eithergripping the selected frame to carry the substrate assembly from thesecond position to the first position at the processing station, orreleasing the selected frame to place the selected frame and substrateassembly back in the cassette.
 3. A method for handling a wafer assemblyhaving a frame, a backing film attached to the frame, and amicroelectronic-substrate assembly attached to the backing film, themethod comprising; moving a clamp of a substrate handling apparatus atan elevation along a processing path through a processing station of aprocessing machine by sliding an arm attached to the clamp along a guidemember having an elongated shape corresponding to the processing path,the clamp being selectively moved between a first position at a firstside of the processing station to hold a substrate assembly at theprocessing station and a second position at a second side of theprocessing station to grip or release a selected frame and substrateassembly in a cassette, wherein the guide member comprises an elongatedchannel in a table of the processing machine, the channel having alength defining a longitudinal axis and the channel being spaced apartfrom the processing path, and the arm comprises a first arm sectionhaving a block with a key received the channel to slidably attach theblock to the table to slide along the channel and a second arm sectionhaving a bar attached to the block, the bar extending upward from theblock and transversely with respect to the processing path to positionthe clamp at the processing path, and wherein moving the clamp comprisessliding the block along the channel; and operating the clamp in thesecond position by either gripping the selected frame to carry thesubstrate assembly from the second position to the first position at theprocessing station, or releasing the selected frame to place theselected frame and substrate assembly back in the cassette.
 4. A methodfor handling a wafer assembly having a frame, a backing film attached tothe frame, and a microelectronic-substrate assembly attached to thebacking film, the method comprising; moving a clamp of a substratehandling apparatus at an elevation along a processing path through aprocessing station of a processing machine by sliding an arm attached tothe clamp along a guide member having an elongated shape correspondingto the processing path, the clamp being selectively moved between afirst position at a first side of the processing station to hold asubstrate assembly at the processing station and a second position at asecond side of the processing station to grip or release a selectedframe and substrate assembly in a cassette, wherein the processingmachine further comprises a servo motor with a drive shaft and athreaded drive member attached to the drive shaft of the servo motor,the drive member being attached to a table of a processing machine andthe drive member extending along the table at least substantiallyparallel to the processing path to also define a guide member, and thearm comprises a first arm section having block with a threaded holereceiving the threaded drive member and a second arm section having abar attached to the block, the bar extending upward from the block andtransversely with respect to the processing path to position the clampat the processing path, and wherein moving the clamp comprises rotatingthe drive shaft and the threaded drive member to slide the block alongthe dreaded drive member; and operating the clamp in the second positionby either gripping the selected frame to carry the substrate assemblyfrom the second position to the first position at the processingstation, or releasing the selected frame to place the selected frame andsubstrate assembly back in the cassette.
 5. A method of handling a waferassembly having a frame, a backing film attached to the frame, and amicroelectronic-device substrate assembly attached to the backing film,the method comprising; translating an arm along a guide member having anelongated shape extending along a processing machine at leastsubstantially parallel to a processing path running from a first side ofa processing station to a second side of the processing stationproximate to a cassette of substrate assemblies coupled to frames,wherein the guide member comprises an elongated beam fixedly attached tofirst and second legs projecting from a table of the processing machine,the beam having a length defining a longitudinal axis and the beam beingspaced apart from the processing path, the arm comprises a first armsection having a bracket slidably attached to the beam to slide alongthe longitudinal axis and a second arm section having a bar attached tothe bracket and extending transversely from the bracket, and whereintranslating the arm along the guide member comprises sliding the bracketalong the beam; and positioning at least a portion of the arm over theprocessing path as the arm translates along the guide member; andselectively closing a clamp to grip a selected frame and substrateassembly to carry the selected substrate assembly from a wafer cassetteto the processing station, and selectively opening the clamp to releasethe selected frame and substrate assembly to place the selectedsubstrate assembly back in the cassette.
 6. A method of handling a waferassembly having a frame, a backing film attached to the frame, and amicroelectronic-device substrate assembly attached to the backing film,the method comprising; translating an arm along a guide member having anelongated shape extending along a processing machine at leastsubstantially parallel to a processing path running from a first side ofa processing station to a second side of the processing stationproximate to a cassette of substrate assemblies coupled to frames,wherein the guide member comprises an elongated rail fixedly attached toa table of the processing machine, the rail having a length defining alongitudinal axis and the rail being spaced apart from the processingpath, and the arm comprises a first arm section having a block with aslot receiving the rail to slidably attach the block to the rail and asecond arm section having a bar attached to the block and extendingtransversely from the block, and wherein translating the arm along theguide member comprises sliding the block along the rail; and positioningat least a portion of the arm over the processing path as the armtranslates along the guide member; and selectively closing a clamp togrip a selected frame and substrate assembly to carry the selectedsubstrate assembly from a wafer cassette to the processing station, andselectively opening the clamp to release the selected frame andsubstrate assembly to place the selected substrate assembly back in thecassette.
 7. A method of handling a wafer assembly having a frame, abacking film attached to the frame, and a microelectronic-devicesubstrate assembly attached to the backing film, the method comprising;translating an arm along a guide member having an elongated shapeextending along a processing machine at least substantially parallel toa processing path running from a first side of a processing station to asecond side of the processing station proximate to a cassette ofsubstrate assemblies coupled to frames, wherein the guide membercomprises an elongated channel in a table of the processing machine, thechannel having a length defining a longitudinal axis and the channelbeing spaced apart from the processing path, and the arm comprises afirst arm section having a block with a key received the channel toslidably attach the block to the table to slide along the channel and asecond arm section having a bar attached to the block, the bar extendingupward from the block and transversely with respect to the processingpath to position the clamp at the processing path, and whereintranslating the arm along the guide member comprises sliding the blockalong the channel; and positioning at least a portion of the arm overthe processing path as the arm translates along the guide member; andselectively closing a clamp to grip a selected frame and substrateassembly to carry the selected substrate assembly from a wafer cassetteto the processing station, and selectively opening the clamp to releasethe selected frame and substrate assembly to place the selectedsubstrate assembly back in the cassette.
 8. A method of handling a waferassembly having a frame, a backing film attached to the frame, and amicroelectronic-device substrate assembly attached to the backing film,the method comprising; translating an arm along a guide member having anelongated shape extending along a processing machine at leastsubstantially parallel to a processing path running from a first side ofa processing station to a second side of the processing stationproximate to a cassette of substrate assemblies coupled to frames,wherein the processing machine further comprises a servo motor with adrive shaft and a threaded drive member attached to the drive shaft ofthe servo motor, the drive member being attached to a table of aprocessing machine and the drive member extending along the table atleast substantially parallel to the processing path to also define aguide member, and the arm comprises a first arm section having blockwith a threaded hole receiving the threaded drive member and a secondarm section having a bar attached to the block, the bar extending upwardfrom the block and transversely with respect to the processing path toposition the clamp at the processing path, and wherein translating thearm along the guide member comprises rotating the drive shaft and thethreaded member to slide the block along the threaded member; andpositioning at least a portion of the arm over the processing path asthe arm translates along the guide member; and selectively closing aclamp to grip a selected frame and substrate assembly to carry theselected substrate assembly from a wafer cassette to the processingstation, and selectively opening the clamp to release the selected frameand substrate assembly to place the selected substrate assembly back inthe cassette.